November 2019, Vol. 246, No. 11

What's New


Intertec Instrumentation launched a range of tough field enclosures for housing remote I/O and other control and instrumentation electronics, featuring compact passive cooling to dramatically reduce costs of ownership. The enclosures help eliminate the need for large satellite instrument houses or remote instrument enclosures, which often need to be air-conditioned and blast- and fire-resistant. Made of glass-fiber reinforced polyester materials, the enclosures are dust- and waterproof. The enclosure concept simplifies the roll-out of more versatile distributed control architectures containing field equipment such as software-configured I/O, IIoT networking and PLCs. Because of the electronic devices used, some form of cooling may also be required. This can be done with conventional fans; however, the temperature stability of the boxes makes it possible to exploit passive cooling techniques.


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